PAI tin/lead no-clean solder pastes are made from a special formulation of highest purity ingredients to ensure the process consistency of today’s demanding ultra-fine-pitch challenges. Our formulation offers a wide processing window and excellent shelf life, with full wetting and clean-ability features to prolong stencil life.
SH6309 is a Sn63/Pb37 alloy with Type 3 particle size (+45 µm 1% less, -20 µm 10% less) and no-clean ROL0 flux. It comes packaged in a 500-gram jar.