High purity alloy that is composed of 60% Tin and 40% Lead from virgin metals. Applies at hand or feed soldering processes in Electronics & Electrical assemblies. Non-corrosive and no impact of flux residues forming at post soldering which means of passing in pin probe & flying probe tests for No-Clean solder wires. If required, flux residues shall be cleaned with the appropriate liquid applications. Précised amount of flux-cored from the state-of-the-art-technology manufacturing process.