PAI Sn63Pb37 solder sticks are being formulated with virgin raw metals processed in state-of-theart Vaccualloy Technology that brings world class quality along. Here, oxygen interaction with alloy is nil and thus, dross formation is reduced at PCB assembly or PCB manufacturing processes. Also an increased flow rate & reduced impurities found. PAI Sn63Pb37 is compatible with typical range of flux application formulas used in Electronics Industry today.